Product Marketing Manager

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues.

Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient.

We are seeking an experienced product marketing leader to drive the market presence of Onto Innovation’s 3

Di™ and IR inspection solutions within the semiconductor process control space. You will serve as the voice of these flagship technologies, creating compelling positioning and go-to-market programs that underscore Onto’s technical advantage and business impact for advanced packaging, HBM, hybrid bonding, logic, and memory fabs.

Onto’s 3

Di and IR inspection platforms—integrated into Onto’s Dragonfly® platform—are reshaping process control in 3D packaging and hybrid bonding. These tools enable manufacturers to achieve unmatched precision in bump height control and detect sub‑micron voids non-invasively. Your role ensures these innovations reach the right audiences with the right message, driving adoption cycles and elevating Onto’s market leadership across inspection and metrology segments.

• Map the competitive landscape and the positioning of 3
  
  Di and IR inspection systems across the entire semiconductor inspection and metrology markets.
• Quantify ROI for these technologies and tie them into yield improvement for HBM, GPU, and hybrid‑bonded logic/memory fabs.

• Develop differentiation strategies to highlight the unique features of 3
  
  Di’s for precision bump metrology and IR inspection for sub‑micron embedded defect detection capability on Dragonfly® platform.
• Craft sector‑specific messaging for advanced packaging, wafer bumping, and hybrid bonding applications.

• Support launches of the technologies through webinars, technical briefs, sales training, and targeted campaigns.
• Enable field teams to articulate how precise bump metrology and sub‑surface defect inspection adds yield trends and defect mapping value across various advanced packaging processes.

• Develop data‑driven toolkits showcasing bump‑height profile reproducibility and void detection sensitivity.
• Equip global sales with ROI‑based calculators and use case playbooks.
• Spearhead participation at SEMICON and Fab‑focused panels where these technologies offer demonstrable competitive advantage.

• Align closely with R&D & product management to feed market insights into future product development.
• Partner with marketing communications team to deliver thought leadership—e.g., application notes, data‑driven proof‑of‑concept content.

• Minimum 5 years in semiconductor process control or advanced packaging inspection/metrology, especially with expertise in 3D bump measurement or hybrid bonding.
• Hands‑on/marketing experience in laser triangulation, IR imaging, or metrology embedded in high‑speed fab tools.

• Familiarity with Onto Innovation’s Dragonfly inspection platform, IR imaging, and associated software platforms (e.g., TrueADC, Discover®, Discover® AI/Defect) is preferred.
• Ability to translate system‑level capabilities into fab‑level business outcomes (yield, throughput, cost of ownership).

• Proven success in developing product launch strategies, technical collateral, and enabling global field sales for complex semiconductor equipment.
• Excellent communicator with demonstrated proficiency in live demos, webinars, case study management, and conference presentations.

• Strong command of…