Sr. Packaging Engineer - Product Introduction

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Xanadu’s mission is to build quantum computers that are useful and available to people everywhere. At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. What we are doing is extremely hard, the classic moon shot. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems and literally change the world.

And that is something to be excited about!

We are looking for a highly motivated and experienced Senior Packaging Engineer - New Product Introduction (NPI) to join our dedicated engineering team. In this pivotal role, you will lead the successful introduction of new packaging processes and technologies from concept to mass production. This involves collaborating with R&D, design, manufacturing, and supply chain teams across the entire product lifecycle to ensure robust, scalable, and ultra-low-loss packaging solutions.

The successful candidate will be working directly with machines as needed throughout the NPI process. Experience using and optimising Ficon

TEC equipment is required.

• New Process Development & Implementation: Lead the development, validation, and implementation of new packaging processes and equipment, from initial concept through pilot production to high-volume manufacturing.
• Process Optimization & Validation: Hands‑on conduct comprehensive process characterization, optimization, and validation for new packaging lines and equipment.
• Equipment Selection &
  
  Qualification:
  
  Research, evaluate, select, and qualify new packaging equipment and materials, staying current with industry trends and advancements.
• Troubleshooting & Problem Solving: Act as a subject matter expert in hands‑on troubleshooting complex packaging process issues during NPI phases and provide ongoing production support.

Manage multiple NPI projects concurrently, ensuring timely delivery and strict adherence to all technical specifications.

• Master's degree in Mechanical Engineering, Electrical and Electronic Engineering, Photonics Engineering, Packaging Engineering, Materials Science, or a related technical field.
• Basic understanding of photonic-based on‑chip and off‑chip systems.
• Minimum of 5+ years of progressive experience in packaging engineering, with a strong emphasis on new product introduction (NPI) within a manufacturing environment.
• Proven experience with various packaging technologies and equipment; experience with Ficon
  
  TEC equipment is strictly required.
• Excellent analytical and problem‑solving skills, with a data‑driven approach to decision‑making.
• Demonstrated ability to manage complex technical projects from conception to completion.
• Exceptional communication, presentation, and interpersonal skills, capable of effectively collaborating with diverse teams and stakeholders.
• Proficiency with CAD software (e.g., Solid Works, AutoCAD) and statistical analysis tools.

• Strong understanding of photonic-based on‑chip and off‑chip systems.
• Proven experience using advanced die‑to‑carrier, die‑to‑die, and die‑to‑wafer bonding techniques.
• Experience with automation and robotics in packaging.
• Familiarity with relevant industry standards and regulations.

Our values are important. They are fundamental and lay the foundation for culture rn more about our values here.

At Xanadu, we are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier‑free workplace. Should you require accommodations at any point during the recruitment process please contact Recruiting at recruiting.

Note:

Xanadu will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting.