Director, Wafer Services: Strategic Packaging
Job in
Tempe, Maricopa County, Arizona, 85285, USA
Listed on 2026-03-01
Listing for:
MIcro-Precision Technologies
Full Time
position Listed on 2026-03-01
Job specializations:
-
Engineering
Job Description & How to Apply Below
A leading semiconductor firm is seeking a Director for their Wafer Services Business Unit in Tempe, AZ. This pivotal role involves managing customer relationships, promoting package technologies, and driving revenue growth. Candidates should have a Bachelor's Degree in Engineering or Science, with at least 10 years of experience in semiconductor manufacturing or packaging. Strong project management skills and proficiency in Microsoft Office are required.
The position offers a hybrid schedule and requires some travel.
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