Director, Chiplets​/FCBGA Integration

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market.

The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit

Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based IC Packages including HDFO (High Density Fan-out) and other advanced IC Package constructions for Computing, Networking and Mobile market spaces. This person will be the primary interface with Tier 1 customers and Amkor's leading edge R&D center in South Korea.

• Drive and coordinate development activities with customers, in conjunction with Amkor's R&D development teams in Korea.
• Lead Tier 1 customer interface meetings, discussions and follow-up actions during the project development phase.
• Manage a cross-functional team with all Amkor resources as required to execute the project in a timely manner, including R&D, Design, Characterization and Simulation teams.
• Manage customer product management through the development phase and into initial production ramp.

• Bachelor's Degree in Engineering, with Mechanical Engineering or Materials Science preferred. A Master's degree is a plus.
• 10+ years of experience in semiconductor package development is required, with direct experience in IC Packaging.
• The qualified candidate understands the IC package design environment, and tradeoffs associated with package design during process development of FCBGA packages.
• A working knowledge of mechanical stress/strain and IC package warpage is required.
• Deep knowledge of IC packaging materials, failure modes and reliability qualification procedures is required.
• Excellent written and verbal communication skills are needed.
• This position requires 10-20% travel including domestic and international travel.

• Expertise in high-density fan-out (HDFO) or bridge-like chiplet module constructions, constraints and tradeoffs.
• Mechanical or Thermal simulation experience.
• Familiarity with Design of Experiments and Statistical Process Control.

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.