Senior RF & Microelectronics Packaging Engineer

A leading communications technology company located in Tempe, Arizona is seeking a Packaging Engineer to manage all aspects of packaging development for RF communication devices. This role requires over 10 years of semiconductor packaging experience, understanding of micro-electronic structures, and strong collaboration skills. The successful candidate will work closely with teams to ensure package reliability and will handle high-level documentation.

A bachelor's degree in a relevant engineering field is essential. Competitive salary range from $153,500 to $242,500 per year, dependent on experience.
#J-18808-Ljbffr