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Hybrid IC Package Design Engineer

Job in Tempe, Maricopa County, Arizona, 85285, USA
Listing for: Amkor Technology, Inc.
Full Time position
Listed on 2026-01-14
Job specializations:
  • Engineering
    Engineering Design & Technologists, Systems Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below
A leading semiconductor packaging company is hiring an IC Package Design Engineer in Tempe, AZ. The candidate will design laminate and wafer-level packages, create engineering drawings, and work closely with product and sales teams. The ideal candidate is self-motivated, has CAD experience, and ideally has semiconductor packaging and PCB design skills. A hybrid schedule is available, and candidates must be eligible for ITAR-sensitive information.
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