Reliability Engineer III

Job Title: Reliability Engineer III

Contract Duration: 12 months, with possible extension
Location: Sunnyvale, CA
Work Arrangement: Onsite
Pay: $70-72/hr

Join a dynamic Reliability Engineering team dedicated to ensuring products meet the highest standards of reliability and performance. This role involves collaborating with cross-functional partners to identify and mitigate risks, develop and execute reliability tests, and analyze data to drive design and process improvements. We are passionate about delivering high-quality products that exceed user expectations and committed to continuous learning and innovation.

• Understand advanced testing methods such as DIC, accelerometer, and strain gauge to train and assist technicians.
• Design, develop, and implement test fixtures and setups to support reliability tests.
• Develop and maintain standard operating procedures (SOPs) for testing and equipment operation.
• Train new personnel on equipment operation and troubleshoot equipment issues.
• Execute high-impact, high-priority reliability test requests and communicate progress effectively.
• Set up and operate test equipment, including sensors, strain gauges, and accelerometers.
• Apply sensors and strain gauges to test specimens and ensure accurate data collection.
• Record and analyze test results, providing clear documentation and interpretation.
• Collaborate with team members to resolve issues and communicate updates to lab leadership.
• Participate in continuous improvement initiatives to optimize test processes and equipment.
• Track time spent on activities and report daily.

• 4–5 years of experience in consumer electronics reliability testing.
• Hands-on experience with:
  • Environmental chambers (heat soak and temperature cycling)
  • Controlled drop towers
  • High-speed video cameras (e.g., Photron or Phantom)
  • Digital microscopes (e.g., Keyence)
  • Universal Testing Machines (e.g., Instron, single- and bi-axial)
  • UV chambers (e.g., Atlas Material Testing)

• Shock towers (e.g., Lansmont)
• Electrodynamic vibration tables
• Digital Image Correlation (DIC)
• Collaborative robot arms (e.g., Universal Robotics)