Photonic Integrated Circuit; PIC Design Engineer

Overview

We engineer Photonic Integrated Circuits endtoend—design, development, and rigorous testing—inside a truly vertically integrated model. You’ll work directly with Nokia’s system and application teams and engage with customers to turn requirements into breakthrough products. Partnering closely with internal manufacturing and leveraging our own fabs, we translate cutting edge photonics into production grade optical modules that power the next generation of optical networks and interconnects of AI applications.

We are developing next-generation coherent telecom and intra-datacenter InP Photonic Integrated Circuits powering optical interconnections. We need motivated engineers and scientists to spearhead developing new products.

A range of experience is needed for numerous openings:
Ph.D. in Electrical Engineering, Physics or Solid State Physics, including new graduates through industry veterans will be considered for various roles up to and including leadership.

• Design of high-speed Mach-Zehnder Modulator or Electro-Absorption Modulator
• Design of high-power or telecom/datacom/datacenter InP lasers (C- or O-band)
• Design of photonic integrated circuits, especially including InP materials

Key engineering expertise in several of the following areas required

• Design and simulation of photonic devices
• Process design/fabrication process development of InP devices or PICs
• Photonic device testing of high-speed modulators
• RF signal integrity design and simulation
• PIC/driver co-design
• Extensive photonic device data analysis in manufacturing environment
• PIC mask layout design expertise with 10 or more layers
• Extensive characterization of semiconductor laser diodes