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Assembly and Packaging Process Engineer
Job in
Sunnyvale, Santa Clara County, California, 94087, USA
Listed on 2026-01-16
Listing for:
Lyte AI Inc.
Full Time
position Listed on 2026-01-16
Job specializations:
-
Engineering
Manufacturing Engineer, Electrical Engineering
Job Description & How to Apply Below
- We are seekinganentryor middlelevelassembly and packaging Engineer with degree in Electrical Engineering, Photonics,Mechanical Engineer,or a related field.
- Work withour
OSATinAsiatosupport company device packaging process improvements for NPI and volume manufacture - Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture
- Project tracking weekly.
- Write technical reports and present results.
- Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpkfor internal use.
- Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly.
- Maintain the software and firmware support for testing and relevant setups.
- Minimal requirement is a bachelor's degree with 1yearsof experience.
- The successful candidate need have English communication capability.
- Experienceor knowledge of PCB assembly with
SMT line - Hands-on experience in laboratory experimentation and data analysis
- English communication capability isa must.
- Familiar with Microsoft Office.
- Fast learner isa must.
- Good work ethics and Maintain company confidential information area must
- Higher degree with more experience is highly desired.
- Experience with microelectronic device packaging.
- Former experience of optical device packaging is highly desirable.
- Experience with hands-on testing of photonic and electronic.device/components.
- Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.
- Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
- Experience in Solid Works and familiar with gren drawingis a plus.
- Data analysis experience such as JMPs is a plus; excel is OK.
- Programming and software maintenance skills aredesiredeg.python, or C++
- Understanding the microelectronic reliability tests and mechanical reliability tests are desirable.
- Experience in microsystem assembly such as hard disk assembly is a plus.
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work oncutting-edge technologies with a highly cross-functional team
- Lyte buildsperceptionsystems for Physical AIoperatingin complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit (Use the "Apply for this Job" box below)..ai
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