More jobs:
Assembly and Packaging Process Engineer
Job in
Sunnyvale, Santa Clara County, California, 94087, USA
Listed on 2026-01-16
Listing for:
Lyte AI Inc.
Full Time
position Listed on 2026-01-16
Job specializations:
-
Engineering
Manufacturing Engineer, Electrical Engineering
Job Description & How to Apply Below
- We are seekinganentryor middlelevelassembly and packaging Engineer with degree in Electrical Engineering, Photonics,Mechanical Engineer,or a related field.
- Work withour
OSATinAsiatosupport company device packaging process improvementsfor NPI and volume manufacture - Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture
- Project tracking weekly.
- Writetechnical reports and present results.
- Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpkfor internal use.
- Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly.
- Maintain the software and firmware support for testing and relevant setups.
- Minimal requirement is a bachelor's degree with 1yearsof experience.
- The successful candidate need have English communication capability.
- Experienceor knowledge of PCB assemblywith
SMT line - Hands-on experience in laboratory experimentation and data analysis
- English communication capability isa must.
- Familiar with Microsoft Office.
- Fast learner isa must.
- Good workethics and Maintain company confidential information area must
- Higherdegree with more experience is highly desired.
- Experience with microelectronic device packaging.
- Former experience of optical device packaging is highly desirable.
- Experience with hands-on testing of photonic and electronic.device/components.
- Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.
- Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
- Experience in Solid Works and familiar with gren drawingis a plus.
- Data analysis experience such as JMPs is a plus; excel is OK.
- Programming and software maintenance skills aredesiredeg.python, or C++
- Understanding the microelectronic reliability tests and mechanical reliability tests are desirable.
- Experience in microsystem assembly such as hard disk assembly is a plus.
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work oncutting-edge technologies with a highly cross-functional team
- Lyte buildsperceptionsystems for Physical AIoperatingin complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit (Use the "Apply for this Job" box below)..ai
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×