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Senior Thermal Engineer

Job in Saratoga, Santa Clara County, California, 95071, USA
Listing for: Piper Companies
Full Time position
Listed on 2026-01-15
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 160000 - 200000 USD Yearly USD 160000.00 200000.00 YEAR
Job Description & How to Apply Below

Piper Companies is seeking a Senior
Thermal Engineer with strong experience developing thermal liquid cooling strategies with specialized hardware for an up and coming AI tech company. The senior Thermal Engineer position is a fulltime opportunity and must be willing to work onsite 5 days a week in Saratoga, CA.

Requirements
  • Develop thermal cooling strategies for high-performance and high speed ASIC’s.
  • Conduct engineering tests to verify designs and support thermal analysis for hardware devices.
  • Perform package design for custom SI single-chip and multi-chip
  • Conduct design analysis and scenarios for novel packaging technologies, including liquid cooling and mechanical design of robust package substrates
Qualifications
  • 10+ years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing
  • Experience with high power SOC liquid cooling design and analysis
  • Advanced understanding of electric cooling challenges in data center environments and heat transfer modes
  • Bachelors in Material Science, Mechanical Engineering, or equivalent industry experience
  • Must be eligible to work in the United States and obtain and maintain an Active U.S Government Secret Clearance
Compensation
  • Salary range: $160,000 - $200,000 annually
  • Comprehensive benefit package;
    Cigna Medical, Cigna Dental, Vision, 401k w/ ADP plus PTO, Sick leave if required by law, and Paid Holidays

明 thermal, engineer, thermal cooling, ASIC, thermal design, Icepak, Flo Therm, Flotherm, Smart

CFD, hardware, product management, packaging technology, SMT, solder ball attach, networking products, network, photonics, photonic integration, Si single-chip, Si multi-chip, SiPi packaging, PCB, system co-design, ODM SMT manufacturing, liquid cooling, FMEAs, SOC liquid cooling, open loop system, closed loop system, CFD, FEA, electronic cooling, heat transfer, thermal airflow testing, mechanical validation, mount technology,

#LI-BH1

#ONSITE

This job opens for applications on 1/12/2026. Applications for this job will be accepted for at least 30 days from the posting date.

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Position Requirements
10+ Years work experience
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