R&D Process Engineering Technician – Heterogeneous Assembly

Overview

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world‑class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award‑winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry‑first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

The High Frequency Technology Center (HFTC) is seeking an R&D Process Engineering Technician to develop, maintain and optimize manufacturing processes to fabricate Keysight’s Heterogeneous System in Package (SiP) technology. This position is onsite at Keysight Headquarters in Santa Rosa, CA. Live in beautiful Sonoma County amongst vineyards, redwood forests, rivers, lakes and coastline while working on state‑of‑the‑art advanced packaging technologies.

The Process Technician will assist with process development and process control to meet quality and production metrics. Responsibilities include a combination of R&D and manufacturing in partnership with Design, Integration, Test, Operations, Maintenance, Product and Failure Analysis teams. The Process Technician works closely with the Process Engineer to deliver on yield, cycle time, throughput, and quality targets for their process. This role involves technical depth in semiconductor processing, sound judgement to make some decisions autonomously, strong hands‑on aptitude, as well as effective communication and teamwork to meet department‑level objectives.

The Assembly Process Engineering Technician will support R&D engineering activities across Heatsink, SMT, and TCB/Advanced Packaging processes. This role requires hands‑on tool operation, execution of development processes, DOE support, data collection, metrology, and continuous improvement. The ideal candidate is detail oriented, highly organized, experienced with semiconductor assembly equipment, and comfortable working in a fast‑paced development environment.

Responsibilities include but are not limited to:

• Operate Thermocompression bonding (TCB), pick‑and‑place, SMT, dry/wet etch, and related assembly tools; execute wet and dry tool‑cleaning processes
• Run metrology and inspection tools (e.g., Zygo profilometers, shear test systems, microscopes, automated inspection systems)
• Perform precision integrated circuit (IC) die handling using tweezers/vacuum wands

• Execute and contribute to engineering experiments, including DOE support, data collection, recipe verification, and MES job transactions
• Interpret engineering data, analyze experimental results, and support process development and optimization

• Partner with Engineering and Operations to implement robust process control, monitor production health, and urgently diagnose/resolve process issues
• Support capital equipment projects including evaluation, characterization, development, and qualification activities

• Generate, track, and report technical data; leverage Python, Excel macros, and SQL to automate data review and monitoring

• Communicate tool and process status across shifts and collaborate with process, equipment, integration, test, and operations teams
• Train operators and engineers on tools, procedures, and best practices

• Adhere to safe chemical‑handling practices and follow established cleanroom and operational protocols

• High school graduate with strong aptitude in science and math. Associate’s or bachelor’s degree in STEM field is highly preferred
• Relevant experience in a cleanroom or high‑tech production floor
• Hands‑on experience with advanced technologies and specific skills in assembly processes
• Strong background in semiconductor…