Senior Package Engineer

Responsibilities

• Provide expert technical support for assembly and test development with a focus on advanced chiplet and multi-die packaging.
• Partner with customers to clarify technical requirements, align specifications, and resolve design and integration issues.
• Collaborate with cross‑functional teams across design, development, test, and packaging to overcome technical challenges.
• Develop and deliver clear, well‑structured technical documentation and presentations for both internal stakeholders and customers.

• Strong knowledge of interposer design and advanced packaging technologies.
• Familiarity with system‑level validation, test methodologies, and productization processes.
• Demonstrated ability to work directly with customers and collaborate across diverse technical teams.

• Expertise in high‑bandwidth interconnects, HBM integration, or multi‑chip module design.
• Understanding of thermal management, signal integrity (SI), and power distribution in advanced packaging.
• Experience in customer‑facing technical roles and/or technical program management.

Mid‑Senior level

Full‑time

Semiconductor Manufacturing