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Principal DRAM Architect – GPU Memory Solutions

Job in Santa Clara, Santa Clara County, California, 95053, USA
Listing for: NVIDIA Corporation
Full Time position
Listed on 2026-01-12
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 272000 - 425500 USD Yearly USD 272000.00 425500.00 YEAR
Job Description & How to Apply Below
Principal DRAM Architect – GPU Memory Solutions page is loaded## Principal DRAM Architect – GPU Memory Solutions locations:
US, CA, Santa Claratime type:
Full time posted on:
Posted Yesterday job requisition :
JR2006279

NVIDIA is seeking a world-class Principal DRAM Architect to define, drive, and deliver the architecture, roadmap, and implementation of next-generation AI and graphics memory solutions! This role sits at the intersection of I/O design, advanced packaging, and process technology, with a mission to co-optimize DRAM, GPU, and system architectures to achieve unprecedented performance, efficiency, and reliability.

As part of NVIDIA’s Memory Architecture team, you will shape the evolution of cutting-edge memory technologies — from TSV stacking and refresh management to advanced reliability and retention schemes — while collaborating closely with leading DRAM vendors and JEDEC working groups to influence global memory standards! Familiarity with HBM, GDDR, and LPDDR is highly valued, enabling broad architectural impact across NVIDIA’s full product portfolio spanning AI accelerators, graphics, data center, and automotive platforms.
** What You’ll Be Doing:
*** Architect next-generation DRAM solutions and NVIDIA-specific implementations — including bank and stack structures, refresh mechanisms, retention schemes, ECC/CRC, power management, and reliability optimization.
* Lead innovation in high-speed memory interfaces, with deep expertise in HBM PHYs (wide I/O, TSV signaling, SI/PI, timing margins) and an understanding of GDDR/LPDDR PHY architectures.
* Collaborate across domains on advanced packaging technologies (TSVs, interposers, CoWoS, hybrid bonding, FOWLP) to optimize DRAM–GPU co-packaging for bandwidth, power, thermal performance, and yield.
* Evaluate emerging DRAM process nodes (sub-1x nm, EUV, new capacitor/dielectric materials) and their impact on density, power, retention, and cost.
* Influence industry direction by working with DRAM vendors and actively contributing to JEDEC committees, driving next-generation memory standards and NVIDIA-specific roadmap alignment.
* Model and quantify system-level trade-offs in bandwidth, latency, power, cost, yield, and thermal behavior to guide architectural decisions.
* Mentor engineers, lead technical reviews, and shape NVIDIA’s long-term memory architecture vision.
** What We Need to See:
*** MS or PhD in Electrical Engineering, Computer Engineering, Physics (or equivalent experience).
* 15+ years of experience in DRAM or memory system architecture, with at least 5+ years focused on HBM (HBM2/2e/3/3e or next-gen).
* Expertise in HBM architecture: TSV design, die stacking, interposer/CoWoS integration, refresh schemes, ECC/CRC, pseudo-channels, and thermal/power management.
* Proven participation in JEDEC or equivalent standards organizations, contributing to DRAM or HBM specifications.
* Demonstrated ability to influence DRAM vendor roadmaps, negotiate trade-offs, and enable early silicon validation.
* Strong understanding of I/O and PHY design fundamentals — timing, SI/PI, equalization, jitter budgeting.
* Proven experience balancing system-level trade-offs across performance, bandwidth, power, cost, yield, and reliability.
* Exceptional technical leadership and cross-functional communication skills.
** Ways to Stand Out from the Crowd:
*** Hands-on experience with GDDR6/7 and LPDDR5/6 architectures — including bank management, signaling, power states, and error handling.
* Deep understanding of thermal and mechanical challenges in advanced memory packaging and 3D integration.
* Familiarity with emerging memory technologies (3D DRAM, MRAM, RRAM, or next-gen hybrid memory).
* Publications, patents, or JEDEC leadership roles demonstrating influence on memory architecture and standards.
* Background in high-bandwidth computing platforms — AI, HPC, or graphics accelerators.#LI-Hybrid Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 272,000 USD - 425,500 USD.You will also be eligible for equity and .Applications for this job will be accepted at least until October 20, 2025.NVIDIA

is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.
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