VP, Advanced Interconnect Technology and Process Integration

Overview

The VP of Technology will be the driving force behind Destination 2D’s technology roadmap — translating breakthrough graphene R&D into qualified, production-ready CMOS interconnect solutions. This is both a strategic and hands-on leadership role, ideal for an executive who combines deep CMOS BEOL process expertise with a track record of technology transfer and productization in advanced semiconductor environments.

• Define and execute Destination 2D’s technology vision, aligning R&D, process integration, and foundry enablement.
• Lead multidisciplinary teams across process, materials, device, and reliability engineering to advance graphene-based BEOL interconnect technologies.
• Oversee wafer-scale process development — spanning material synthesis, patterning, intercalation doping, metallization, and low-k dielectric integration.
• Drive data-backed qualification and process optimization, ensuring manufacturability and foundry compatibility.
• Build strategic relationships with foundry and equipment partners, guiding joint technology development programs.
• Establish internal technology milestones, PDK integration plans, and reliability standards to support future product design-in.
• Mentor a growing technical organization while fostering cross-functional collaboration with business and operations teams.

• Ph.D. or M.S. in Electrical Engineering, Materials Science, or related discipline.
• 12+ years of experience in advanced CMOS process technology, BEOL development, or interconnect engineering — preferably within foundry or IDM settings.
• Expertise in metallization, low-k dielectrics, and BEOL process integration required; familiarity with graphene or 2D materials is highly desirable.
• Strong record of technical execution, team leadership, and cross-industry collaboration.
• Proven leadership in bringing new technologies from concept through foundry qualification.
• Entrepreneurial mindset suited to an agile, innovation-driven startup environment.

Join a team defining the future of semiconductor interconnects — where atomically-thin materials meet high-volume manufacturing. At Destination 2D, you’ll help rewrite the limits of performance, energy efficiency, and material scaling.

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