Junior Wafer Coating Process Engineer
Listed on 2026-01-20
-
Engineering
Electronics Engineer, Manufacturing Engineer, Electrical Engineering
Job Description
We are seeking a entry-level Wafer Coating Process Engineer to join our growing team. You will be primally responsible for spin-coating and annealing based thin film deposition, characterization, wafer dicing and polishing. Ideal candidate must possess knowledge and experience of spin-coating process, logical thinking, communication skills, team-working, flexibility and “can-do” attitude.
Primary Responsibilities will be a couple of processes below.
- Spin-coating
- Thin film annealing
- Thin film characterization
- Wafer dicing
- Chip edge polishing
Education and Experience
- Education requirement:
Preferred with an AA, BS or higher in technical field. - Experience requirement: over 1 years in wafer handling process with tweezers.
- Preferred experience:
Knowledge and/or experience in spin-coating and chemicals. - Candidate must be highly motivated and organized.
Epi Photonics USA, Inc. is a manufacturer of world leading high-speed PLZT photonic components located in Silicon Valley and Japan.
Company DescriptionEpi Photonics USA, Inc. is a manufacturer of world leading high-speed PLZT photonic components located in Silicon Valley and Japan.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).