Sr Principal Hardware Design Engineer

Job Summary

Responsible for designing decorating and testing high-speed electrical circuits and interfaces for co-packaged optical modules, which integrate optical components directly onto the same substrate as electrical chips. This role requires expertise in high-speed digital and analog circuit design, signal integrity, power delivery, and PCB design, as well as a strong understanding of optical communication principles.

• Work with external design house to design and develop Si/organic RDL interposer.
• Design and layout high-speed PCBs for co-packaged optics modules and EVB, considering signal integrity, power delivery, and thermal management requirements.
• Perform signal integrity analysis and simulation to ensure optimal signal transmission and minimize signal degradation in high-speed links.
• Design and optimize the power delivery network for co-packaged optics modules to ensure stable and reliable power delivery to all components.
• Select appropriate electrical components, including connectors, cables, and ICs, for co-packaged optics modules.
• Develop test plans and procedures to validate the performance of co-packaged optics modules, including high-speed electrical interfaces, power delivery, and thermal management.
• Collaborate with optical engineers, mechanical engineers, and other cross‑functional teams to integrate electrical and optical components into a cohesive system.

• Ph.D in Electrical Engineering/Physics/Applied Physics with 3+ years’ experience
• Strong foundation in digital, analog, and high-speed circuit design, simulation, and verification
• Laboratory experience with high спраш high-speed optical and electrical test equipment
• Proven track record with new product introductions and product ramp
• Knowledgeable of high-speed optoelectronic devices (e.g., lasers, detectors, modulators)
• Multi-disciplinary background with a demonstrated record of innovation
• Excellent communication, organizational, and time management skills

Mid‑Senior level

Full‑time

Engineering and Design

Telecommunications and Semiconductor Manufacturing