Field Application Engineer

Field Application Engineer

Base pay range: $/yr - $/yr

• Bachelor’s degree, or higher, in Electrical, Chemical, Mechanical or Manufacturing Engineering.
• Minimum of 7 years technical experience in the Printed Circuit Board Industry.
• Solid experience in PCB manufacturing process.
• Experience with PCB design, layout, and testing.
• Solid experience in stack-up evaluation and creation.
• Solid knowledge of laminates and their electrical and mechanical properties.
• Experience with PCB design tools such as Cadence, Polar IS9000, Gerber viewers, etc.
• Proficiency in troubleshooting and diagnosing technical issues.
• Effective communication and presentation skills.
• Ability to work collaboratively with cross-functional teams.
• Excellent problem-solving skills and attention to detail.
• Experience in customer support and providing technical solutions.
• Job requires a fair amount of business travel throughout Asia and North America.
• Training 2-3 weeks in Asia after hired

• Provide technical support and solutions to customers and prospects.
• Troubleshooting and diagnosing technical issues, and collaborating with other teams to ensure customer satisfaction.
• Day-to-day tasks include responding to customer inquiries, creating and delivering technical presentations, and providing feedback to the internal product development team.
• Responsible for making recommendations for future technological needs based on customer feedback and market trends.

Mid-Senior level

Full-time

Semiconductor Manufacturing