MEMS R&D Process Development and Integration Engineer

Frore Systems is a leader in groundbreaking thermal technologies, transforming performance for data centers, embedded industrial systems, and consumer electronics. The company’s innovative solutions include Liquid Jet™, a 3D short-loop jet channel coldplate that enhances GPU performance and reduces data center costs, and Air Jet®, the world’s first solid‑state active cooling chip, designed for consumer, industrial, and edge devices. Frore Systems is trusted by top global OEMs and is headquartered in Silicon Valley with manufacturing operations in Taiwan.

The MEMS R&D Process Development and Integration Engineer will lead the development, integration, and scale‑up of advanced microfabrication and packaging processes for next‑generation Air Jet devices. This role bridges device physics, materials science, and manufacturing engineering to deliver robust, high‑yield production  will operate at the critical interface between R&D and high‑volume manufacturing — building process capability in the R&D fab while ensuring disciplined, repeatable transfer to production.

This is a highly hands‑on role requiring deep technical ownership and strong cross‑functional collaboration.

• Lead development of next‑generation Air Jet process nodes and drive successful transfer to manufacturing.
• Own process integration across full device fabrication flow, including wafer processing, bonding, and final assembly.
• Work hands‑on in the cleanroom with tools, materials, and devices to establish robust, scalable process windows.
• Define critical process parameters and expand operating margins to enable high‑yield production.

• Specify, select, and qualify key process equipment for advanced node development in the R&D fab.
• Establish supporting ecosystem infrastructure including materials, tooling, and metrology.
• Develop equipment qualification protocols and process validation strategies.
• Drive capability ramp from lab‑scale development to pilot production readiness.

• Partner with NPI and manufacturing teams to improve yield, reliability, throughput, cost and performance.
• Lead structured root cause analysis for device failures and process excursions.

• Implement SPC methodologies and drive continuous process improvement.

• Thin‑film deposition
• Photolithography
• Dry and wet etch
• Metal‑to‑metal bonding (fusion, eutectic, solder, epoxy, silicone)
• Integrate device physics and materials behavior into process decisions.
• Analyze large‑area wafer behavior, stress management, and thermal performance impacts on device function.
• Drive bonding and packaging process optimization for reliability and manufacturability.

• Design and execute structured DOEs to optimize performance and yield.
• Apply statistical tools including SPC, FMEA, and process capability analysis.
• Leverage JMP, Tableau, Power
  
  BI, or similar tools to extract insights from complex datasets.
• Develop data‑driven models to predict and control process outcomes.

• Ensure safe operation of chemical, vacuum, and thermal systems.
• Maintain environmental and safety compliance within R&D and pilot manufacturing.

• 3+ years of process engineering or process integration experience in semiconductor, display, or advanced electronic packaging environments.
• M.S. or Ph.D. in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or related technical field.
• Strong foundation in Materials science and material behavior, Large‑area semiconductor/display processing, Thermal interface materials, adhesives, and coatings
• Hands‑on experience in R&D and High‑volume manufacturing environments.

• Proven experience with bonding technologies (fusion, eutectic, solder, epoxy).
• Deep knowledge of DOE, SPC, FMEA, and process validation methodologies.
• Strong cross‑functional collaboration skills across R&D, product design, and operations.
• Ability to thrive in a fast‑paced, high‑growth environment.

• Base salary range: $110,000 - $180,000 depending on experience
• Total compensation includes base salary, relocation allowance if applicable, potential annual bonus and equity award