Manufacturing Process Engineer

Job Description

We are seeking a highly skilled Manufacture Process Engineer to lead and optimize manufacturing processes for Printed Circuit Board Assemblies (PCBA). This role is critical in ensuring high-quality, reliable, and cost-effective production through expertise in stencil design, soldering processes, wave solder profiling, conformal coating, and secondary operations. The ideal candidate will bring deep technical knowledge, hands-on experience, and a continuous improvement mindset to advance our PCBA manufacturing capabilities.

⚙️ Key Responsibilities

• Process Development & Optimization
• • Design, validate, and optimize stencil designs for solder paste application.
  • Develop and maintain reflow soldering profiles, including vapor phase reflow processes, to ensure robust solder joints and minimize defects.
  • Establish and refine wave soldering profiles for through-hole components.
  • Define and implement secondary operations including press-fit connector installation, heat sink attachment, and mechanical assembly steps.
  • Develop and oversee conformal coating processes to ensure environmental protection and product reliability.
  • Create and enforce rework standards for soldering, ensuring compliance with IPC and industry best practices.
• Manufacturing Support
• • Provide technical leadership to production teams in troubleshooting assembly issues.
  • Collaborate with design engineering to ensure manufacturability of PCB layouts and component selection.
  • Drive yield improvement initiatives and root cause analysis for process-related defects.
  • Lead Corrective and Preventive Action (CAPA) initiatives to eliminate recurring issues and strengthen process robustness.
  • Support new product introduction (NPI) by developing scalable and repeatable assembly processes.
• Quality & Compliance
• • Ensure adherence to IPC-A-610, J-STD-001, IPC-7711/7721, and other relevant industry standards.
  • Maintain documentation of process parameters, work instructions, and control plans.
  • Partner with quality engineering to implement corrective and preventive actions (CAPA).
• Continuous Improvement
• • Lead projects focused on automation, efficiency, and cost reduction.
  • Evaluate and introduce new technologies, equipment, and materials to enhance PCBA processes.
  • Train and mentor junior engineers and technicians in advanced assembly techniques.

Qualifications & Experience

• Education:
  Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field. Master’s preferred.
• Experience:
  Minimum 7–10 years in PCBA manufacturing engineering, with proven expertise in:
• • Stencil design and solder paste application.
  • Reflow soldering (including vapor phase reflow) and thermal profiling.
  • Wave soldering process development and optimization.
  • Conformal coating application and process control.
  • Secondary operations (press-fit connectors, heat sinks, mechanical assembly).
  • Rework and repair standards for solder joints.
  • Root cause analysis and CAPA methodologies for troubleshooting and issue resolution.
• Strong knowledge of IPC standards (IPC-A-610, J-STD-001, IPC-7711/7721).
• Hands-on experience with SMT equipment, AOI/X-ray inspection, and process monitoring tools.
• Demonstrated success in NPI process development and scaling to volume production.
• Excellent problem-solving, analytical, and communication skills.
• Ability to lead cross-functional teams and drive process improvements in a fast-paced environment.

Preferred Skills

• Experience with Design for Manufacturability (DFM) and Design for Test (DFT) principles.
• Familiarity with Lean Manufacturing and Six Sigma methodologies.
• Proficiency in CAD tools for stencil and fixture design.
• Knowledge of advanced soldering techniques (selective soldering, laser soldering).
• Strong project management and leadership capabilities.