Modem Power Engineer

Company

Qualcomm Technologies, Inc.

Engineering Group, Engineering Group >
Modem Software Engineering

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Modem Software Engineer, you will design, implement, verify, validate, and commercialize the Wireless WAN (or cellular) core network and data connectivity software solutions on our modem. Qualcomm Engineers collaborate with cross‑functional teams to commercialize end‑to‑end complete modem SW package as a full component.

• Bachelor's degree in Computer Engineering, Computer Science, Electrical Engineering, or related field.

• Basic understanding of digital communications, RF propagation, and telecommunications concepts
• Exposure to 5G , LTE, and interest in emerging 6G technologies
• Familiarity with data protocols (e.g., IP, TCP) through coursework or projects
• Awareness of air interface performance analysis and optimization
• Basic programming ability in Python or similar languages
• Familiarity with real‑time operating systems and multi‑threaded processor architectures is a plus
• Familiarity with commercial wireless test equipment (e.g., Keysight, R&S, Anritsu) is a plus
• Effective communication and teamwork skills; willingness to learn and collaborate
• Exposure to AI/ML and Large Language Models (LLMs), with interest in applying these techniques to wireless system design and power optimization
• Knowledge of Embedded Power Architecture, power grid analysis, and basics of power measurement techniques is an added plus.

• Work on Next Generation Wireless Technologies, including 5G , LTE Advanced, and emerging 6G standards, focusing on critical modem stack software, firmware, and hardware features from both UE and network protocol perspectives. Investigate, analyze, and optimize systems for power and thermal characteristics, with close attention to performance KPIs.
• Integrate and test system‑level features across a broad range of modem capabilities, design comprehensive test content, and optimize system performance with a focus on evaluating power cost. Support customer (OEMs and Carrier) requirements for product commercialization.
• Analyze and debug issues related to power optimization features, studying their impact on stability and performance while maintaining the balance between power and performance.
• Collaborate with a multidisciplinary team (Software Development, System Design, Chipset Architecture, Customer Support, Tools, etc.) to integrate, test, and commercialize QCT products. Responsible for triaging issues, raising bug tracking tickets, and driving closure to meet requirements.
• Recommend optimizations and suggestions to prototype algorithms and designs as proof of concept of modem power optimization features.
• Apply AI/ML techniques to improve power analysis and optimization, leveraging exposure to AI/ML and Large Language Models (LLMs) in wireless system design.
• Adopt LLM‑based tools to automate analysis, enhance debugging, and streamline feature integration processes.
• Stay current with advancements in 6G and AI/ML technologies, proactively identifying opportunities to incorporate these innovations into modem power solutions.

• Works under supervision.
• Decision‑making affects direct area of work and/or work group.
• Requires verbal and written communication skills to convey basic, routine factual information.
• Tasks consist of a limited number of steps and can be referenced using directions or manuals.

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The above pay scale reflects the broad, minimum to maximum pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation  also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus).

In addition, our highly competitive benefits package is…