Principal Signal & Power Integrity Engineer; SI​/PI Engineer

Overview

Our client is a leading maker of IC and SoC technology for various markets including broadband, wired, and wireless infrastructure, data centers, and industrial applications. Their products are used in Fiber Optics, WiFi, 4G and data center connectivity. They are currently seeking a Principal Signal and Power Integrity Engineer who will be responsible for package and PCB development for the company’s next generation products, as well as SI and PI simulations, and design/simulation of high speed interfaces.

This individual will work on various types of products spanning from RF technology to Optical DSP technology.

• Own package and PCB development for next generation products, including SI and PI simulations and design/simulation of high speed interfaces.
• Collaborate across product teams to address SI/PI challenges in RF, optical DSP, and related technologies.
• Support verification and validation activities and provide design recommendations to meet performance targets.

• BSEE with 9 years of industry experience (MSEE with 7, PhDEE with
  4) in Signal and Power Integrity Engineering.
• Proficiency with ED/EDA tools including HFSS and SIWAVE.
• Experience with Flip-Chip Package Design and substrates is ideal but not required.
• Strong exposure to Ser Des technology.
• Experience with Optical DSP technologies and PAM4 is preferred but not required.