Summer Intern - Etch Process Engineer

Overview

2026 Summer Intern - Etch Process Engineer at TSMC Washington in Portland, OR. This internship provides exposure to the integration of diverse engineering and scientific disciplines—including Chemical, Chemistry, Electrical, Physics, and Material Science—as applied to critical industrial processes within semiconductor manufacturing. Under the guidance of experienced mentors, you will gain practical experience in process operations and control, process monitoring and analysis, and experimental design and analysis (DOE) for etching processes to optimize performance.

Key projects focus on system improvement initiatives to enhance production line efficiency.

• Process Operations & Control:
  Contributing to daily process operations and statistical process control (SPC) activities.
• Process Monitoring & Analysis:
  Learning theoretical foundations of process monitoring and applying them to real-world scenarios.
• Experimental Design & Analysis (DOE):
  Designing, executing, and analyzing DOEs specifically for etching processes to optimize performance.
• Investigate system improvements aimed at reducing monitoring time and enhancing production efficiency.
• Apply big data analysis techniques to identify bottlenecks and opportunities for efficiency gains.
• Prepare comprehensive reports detailing efficiency gains and propose further optimizations.

• Currently enrolled in and have completed the sophomore year (or equivalent) of an accredited bachelor’s degree program in a relevant engineering or scientific discipline.
• Maintain a minimum cumulative GPA of 3.25 on a 4.0 scale (or equivalent).
• Must be legally authorized to work in the United States on a long-term basis without the need for current or future employer-sponsored immigration status (e.g., H-1B, OPT, O-1, TN visas).
• Ability to commit to full-time on-site work (40 hours per week, Monday through Friday, 8:00 AM - 5:00 PM) at our Camas, WA location for the entire duration of the internship.

• For Semester System Students:
  May 18, 2026 – July 24, 2026
• For Quarter System Students:
  June 22, 2026 – August 28, 2026

• Demonstrated strong problem-solving skills, effective communication abilities, and a collaborative team-oriented spirit.
• Proactive and self-motivated learner with a strong desire for active engagement and continuous improvement.
• Ability to adapt to changing priorities in a dynamic business environment.
• Excellent communication (verbal and written), computer proficiency, presentation skills, and active listening abilities.

• Some roles may require the ability to lift and move materials in accordance with safety guidelines.
• Work in a cleanroom environment, adhering to gowning protocols and spending significant time on the factory floor operating and monitoring tools.

• Familiarity with semiconductor manufacturing processes and design principles.
• Experience or coursework demonstrating proactive collaboration and teamwork in project-based settings.
• Experience in presenting and discussing work within a team environment.

The starting wage typically ranges between $23.00 and $27.00 per hour. This description reflects base pay as part of a comprehensive compensation package.

Benefits include eligibility for the 401(k) plan, medical benefits, paid sick leave (one hour per 40 hours worked), on-site fitness center, game room, physical therapist, and subsidized café. For questions, email

TSMC Washington, LLC is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law.

TSMC

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