Sr. Foundry Technologist - Process Integration

Key Responsibilities:

Intel Corporation is seeking an accomplished Foundry Technologist - Process Integration to lead the development and customization of advanced foundry technologies. This role is pivotal in enhancing high-performance logic CMOS technology for a broad spectrum of applications, including AI, Datacenter, Client, and Edge solutions.

• Lead a process development team focused on enabling and optimizing high-performance semiconductor logic technologies for large-volume manufacturing.
• Collaborate with cross-functional teams to gather customer requirements and translate them into tailored, innovative solutions.
• Drive the customization and implementation of semiconductor logic technologies, ensuring seamless integration with Intel’s established manufacturing processes and platforms.
• Provide technical guidance and mentorship to junior engineers and researchers, fostering a culture of continuous learning and professional growth.
• Monitor industry trends, emerging technologies, and evolving customer needs to inform process customization strategies and identify opportunities for ongoing improvement.

• Master's degree in Electrical Engineering, Physics, Material Science or a related field is required. Ph.D. degree is preferred.
• Minimum of 15 years of experience in the semiconductor foundry industry, with a strong focus on technology development and, or customization.
• Minimum 5 years in Advanced CMOS technology and its customization.
• Proven track record of as part of foundry in developing and customizing logic technologies for specific customer requirements.
• Strong understanding of manufacturing processes and platforms, with experience in large volume manufacturing.
• Exposure to the foundry ecosystem is a requirement.
• Excellent leadership skills with the ability to lead cross-functional teams and drive collaboration.
• Excellent communication skills, both verbal and written, with the ability to convey complex technical concepts effectively.

• Work in 3nm-16nm FinFET and sub 3nm GAA.
• Experience in Yield Improvement and High-Volume Manufacturing.
• Experience in Power-performance optimization.
• Experience in 3
  
  DIC development, including TSV (and interaction with CMOS, packaging).

This position offers a unique opportunity to shape the future of Intel’s semiconductor solutions, directly supporting the company’s efforts to meet diverse industry needs and maintain leadership in high-volume manufacturing.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

This role is a Position of Trust.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $- USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.