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Global Lead, Advanced Packaging Substrate Enablement

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-03-07
Job specializations:
  • Engineering
    Manufacturing Engineer, Quality Engineering
Salary/Wage Range or Industry Benchmark: 140830 - 269950 USD Yearly USD 140830.00 269950.00 YEAR
Job Description & How to Apply Below
A leading technology firm located in Phoenix, Arizona, is seeking an Advanced Packaging Substrate Supplier Enablement Lead. This role focuses on driving supplier readiness and advancing technology maturation within semiconductor manufacturing. The ideal candidate will have extensive experience in advanced packaging and supplier management, aiming to enhance supply resilience while fostering innovation. This position requires a bachelor's degree and significant experience in a related field, highlighting strategic alignment and problem-solving capabilities.

Competitive salary and benefits included.
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