Semiconductor Packaging Mechanical Engineer

Job Details

Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud‑to‑edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life.

Join us and help make the future more wonderful for everyone.

We are hiring a highly motivated mechanical engineer for the Advanced Packaging Mechanical Analysis team located in Chandler, AZ. This role focuses on developing multiphysics thermo‑mechanical simulations to support design, definition, development and qualification of advanced semiconductor packaging led by Intel Foundry. The position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups.

This role requires regular onsite presence.

• Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
• Collaborate with cross‑functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
• Drive strategic development activities and work closely with internal and external customer organizations to plan, execute, and communicate development activities and programs.
• Leverage experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
• Use advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.

• Demonstrated ability to work seamlessly between experiments and simulations.

• PhD in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field with emphasis in solid mechanics.
• 3+ years of thermal‑mechanical work/research experience with emphasis on silicon reliability.
• 3+ years of experience with Finite Element Analysis tools.
• 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano‑indentation.

• Experience with multi‑physics simulations, including coupled electro‑thermal‑mechanical analysis, free surface two‑phase flows, electroplating and plasma.
• Experience with co‑packaging optics, optical coupling, fiber pigtail attachment, free space optics.
• Experience with designing, planning and executing experiments, along with interpretation of results.
• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
• Strong understanding of advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
• Programming/script development with artificial intelligence and machine learning concepts.
• Previous related work experience in a semiconductor foundry preferred.

Our total rewards package includes competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. The annual salary range for this position in the US is $ – $ USD.

This role will require an on‑site presence.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.