Module Engineering Managers

Module Engineering Managers
TSMC is looking for managers in the following modules: CMP, CVD, Diffusion, Epitaxy, Etch (Dry), Etch (Wet), Lithography, Metrology, and PVD.

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. If you believe in building a future together with us and have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona is looking for Module Engineering Manager(s) to join our 4-nanometer fab, located in sunny Phoenix, Arizona. As a Module Engineering Manager, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

• CMP:
  Chemical Mechanical Polishing – Senior Engineering Manager – Module process and equipment fundamental improvements.
• CMP, CVD, Diffusion, Epitaxy, Etch (Dry), Etch (Wet), Lithography, Metrology, PVD:
  Elevate engineering and manufacturing excellence in their respective departments and collaborate with Process Integration, Manufacturing, Yield improvement, and Cross-Module teams to sustain high-quality wafer production and delivery. (
  
  Note:
  
  responsibilities for each module are listed under their headings below.)

• Responsibilities Include:
  
  Module process and equipment fundamental improvements.
• Work with Process Integration, Manufacturing, Yield improvement, and Cross-Module teams to sustain high-quality wafer production and delivery.

• Responsibilities Include:
  
  Elevate engineering and manufacturing excellence in the Chemical Vapor Deposition department.

• Responsibilities Include:
  
  Elevate engineering and manufacturing excellence in the Diffusion department.
• Module process and equipment fundamental improvements.
• Innovate and seize opportunities for wafer quality and productivity improvement.
• Work with Process Integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery.
• Proactively identify talent and continuously develop team members with a deliberate road map.

• Responsibilities Include:
  
  Work with mother Fab ETC team to fingerprint all ETC tools to ensure seamless technology transfers.
• New production line setup and maintenance.
• Equipment troubleshooting.
• Resource planning, task prioritization, and related cross-function management work to move-in, install and qualify tools.

• Responsibilities Include:
  
  Work with the mother Fab WET team to fingerprint all WET processes and/or tools to ensure seamless technology transfers.
• Plan resources, prioritize tasks, and perform in a cross-function team to move-in, install and qualify tools/processes.
• Monitor process/equipment performance indices and establish good controls to maintain HMV wafer output.
• Establish workflow, corrective action and prevention plans for HVM process/equipment issues.
• Improve productivity through rigorous SOP system control, and process/equipment optimization.

• Responsibilities Include:
  
  Ensure that production line is operating 7x24 and meets all quality standards.
• Hire/Manage a team of engineers/technicians.
• Establish effective defense mechanisms to ensure EUV/DUV photomask quality, including defectivity and pattern performance.
• Develop and implement process improvements to increase yield and reduce costs.
• Collaborate with equipment suppliers to ensure equipment performance meets process requirements.

• Responsibilities Include:
  
  Ensure that the EUV Scanner is operating 7x24 at peak performance and meets all quality and safety standards.
• Hire/Manage a team of engineers/technicians.
• Collaborate with other departments to ensure that EUV scanner is integrated into the overall manufacturing process.
• Manage budgets and resource allocation for the EUV scanner team.
• Establish clear expectations and encourage continuous improvement to tool…