Advanced Packaging Module Engineer; Hybrid
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-02-28
Listing for:
Intel Corporation
Full Time
position Listed on 2026-02-28
Job specializations:
-
Engineering
Packaging Engineer, Mechanical Engineer, Product Engineer, Manufacturing Engineer
Job Description & How to Apply Below
A leading technology company in Phoenix is looking for a Packaging Module Development Engineer. In this role, you will develop innovative packaging solutions that ensure the performance, reliability, and quality of Intel products. You will collaborate with cross-disciplinary teams and drive the development of advanced packaging technologies. A Bachelor's degree in Mechanical Engineering or a related field and several years of relevant experience are required.
This position also offers a hybrid work model and competitive compensation.
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