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Packaging Equipment Innovator Module Solutions

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-02-28
Job specializations:
  • Engineering
    Packaging Engineer, Manufacturing Engineer
  • Manufacturing / Production
    Packaging Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 115110 - 219550 USD Yearly USD 115110.00 219550.00 YEAR
Job Description & How to Apply Below
Position: Packaging Equipment Innovator for Module Solutions
A leading semiconductor company seeks a Packaging Module Equipment Development Engineer in Phoenix, Arizona. The role involves developing innovative assembly processes and equipment to enhance manufacturing efficiency in packaging technologies. Candidates must possess a relevant engineering degree and extensive experience in equipment support. This position requires on-site presence and offers a competitive salary package including bonuses and benefits.
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