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Senior Semiconductor Packaging Mechanical Engineer

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-02-28
Job specializations:
  • Engineering
    Mechanical Engineer, Electrical Engineering, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 122440 - 232190 USD Yearly USD 122440.00 232190.00 YEAR
Job Description & How to Apply Below
A leading semiconductor company is looking for a Semiconductor Packaging Mechanical Engineer in Phoenix, Arizona. This full-time role involves developing multiphysics thermal-mechanical simulations for advanced semiconductor packaging. Candidates must have a PhD in a relevant field and significant experience in thermal-mechanical work. The position requires collaboration across teams and regular on-site presence. The estimated annual salary ranges from $122,440 to $232,190, reflecting experience and location.
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Position Requirements
10+ Years work experience
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