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Senior Silicon Packaging Design Engineer; DIC Hybrid

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-01-14
Job specializations:
  • Engineering
    Systems Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: Senior Silicon Packaging Design Engineer (3DIC) Hybrid
A leading semiconductor company based in Phoenix, AZ is seeking a Senior Silicon Applications Engineer (Packaging Design) to focus on advanced packaging technologies. You will engage with customers, analyze design challenges, and provide innovative solutions in a cross-functional team environment. The role requires a Bachelor's degree and significant experience in Package Design. Competitive compensation and a hybrid work model are offered, along with the opportunity to work on cutting-edge technologies.
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Position Requirements
10+ Years work experience
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