Packaging Module Development Engineer

Overview

Join our team to work on cutting-edge applications of machine vision and machine learning to solve complex semiconductor packaging manufacturing challenges.

• Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
• Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
• Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
• Conducts tests and research on basic materials and properties.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
• Provides consultation concerning packaging problems and improvements in the packaging process.
• Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.

• Possess a Bachelor's degree in Engineering, Physics, or Computer Science or related field with 3+ months of experience
• -OR- master's degree in engineering, Physics, or Computer Science or related field with 6+ months of experience

Relevant experience must include the following:

• Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction.

• Semiconductor Inspection (wafer, package, etc.).
• Fundamental physical processes, troubleshoot complex ultra-high precision equipment across a variety of disciplines including optical, laser, motion or electrical systems.
• Statistical principles, process control (SPC) and Design of Experiments (DOE).
• Fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.
• Semiconductor devices and packing technology.
• Data science and statistics tools (Python is highly preferred).
• Data management and visualization experience.
• Dimensional management for package features and planes.
• Machine Vision techniques, OpenCV experience and CNN Image Classification.

Job Type: College Grad

Shift: Shift 1 (United States of America)

Primary

Location:

US, Arizona, Phoenix

Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.

Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust: N/A

Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $85,.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.