Silicon Packaging Architect​/Engineer

Position: Silicon Packaging Architect / Engineer
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** Welcome!**## .Silicon Packaging Architect / Engineer page is loaded## Silicon Packaging Architect / Engineer locations:
US, California, Santa Clara:
US, Oregon, Hillsboro:
US, California, Folsom:
US, Arizona, Phoenix time type:
Full time posted on:
Posted Yesterday job requisition :
JR0279284#
** Job Details:**##

Job Description:

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.

We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

** About This Opportunity:
** Join Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities. WCS focuses on developing advanced wireless technologies and solutions that enable seamless connectivity across a wide range of devices and platforms. The group specializes in wireless communication products including Wi-Fi, Bluetooth, and emerging wireless standards, delivering high-performance, reliable, and secure wireless solutions.

WCS drives innovation in wireless connectivity by integrating cutting-edge hardware and software technologies to meet the evolving needs of consumers and enterprise customers. The business unit ensures regulatory compliance and quality through rigorous product regulatory life cycle management aligned with Intel's global standards and country-specific requirements.

WCS is committed to advancing wireless communication capabilities, supporting Intel’s leadership in the wireless ecosystem, and enabling next-generation connected experiences.

As a Silicon Packaging Architect/Engineer, you'll drive cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products, focusing on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization.
** What You'll Do -  Strategic Leadership and Architecture:
*** Translate product requirements into comprehensive package architecture specifications
* Lead technology trade-off decisions ensuring packages meet electrical, mechanical, thermal, and reliability standards
* Define overall product package performance specifications and drive technology certification
* Oversee end-to-end package development processes, from design through production
** Technical Excellence and

Innovation:
*** Troubleshoot complex packaging problems and develop innovative, cost-effective solutions
* Research packaging assembly materials and properties, establishing specifications for suppliers
* Perform mechanical and reliability simulations to optimize package design
* Conduct thermal performance simulations using predictive FEA analysis
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* Cross-Functional Collaboration:

*** Partner with silicon, hardware, and package design teams to ensure high-quality deliverables
* Coordinate with internal/external manufacturing partners (OSATs) and substrate suppliers
* Support product co-design and layout teams as manufacturing liaison
* Collaborate with Quality & Reliability teams to ensure products meet specifications
* Complete DFMEA assessments with assembly suppliers to evaluate technology risks
** Manufacturing and Process Management:
*** Ensure seamless transition from design to high-volume production
* Design and validate Test Vehicles for process characterization
* Provide consultation on packaging improvements and process optimization##
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* Qualifications:

** You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.
** This position is not eligible for Intel immigration sponsorship.
**** Education and Experience

Minimum Requirements:

** Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field + 4+ years industry experience OR Master's degree in relevant field + 3+ years experience OR PhD in relevant field + 1+ years experience    
** Required Technical

Skills:

*** 2+ years package assembly technology development experience
* 2+ years packaging physics (mechanical and thermal) and/or materials experience
* 2+ years package assembly manufacturing processes and HVM ramp experience
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* Preferred Qualifications:

*** Semiconductor device physics and process engineering experience
* RF Component Packaging experience (highly valued for wireless products)
* Testing systems experience with…