Packaging Module Development Engineer

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** Welcome!**## .#
** Job Details:**##

Job Description:

Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision.

Join us and build on our legacy of innovation and collaboration as we deliver world-changing technology that improves the life of every person on the planet.

We are looking for someone who is:
Passionate about learning new technical skills in software development and test technology. Passionate about helping colleagues and partners to deliver higher-quality software. Excited to work collaboratively on a scrum team Able to work asynchronously as part of a global team. Excited to enable Intel IT to deliver amazing quality and value to our customers while helping IT teams do great work and have fun.

The primary responsibilities for this role will include, but are not limited to:
* Develops assembly processes and/or equipment and apply novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
* Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces. Ensures manufacturability of physical layout of package design and oversee the cycle of manufactured package processes, procedures and flows.
* Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
* Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
* Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation concerning packaging problems and improvements in the packaging process and responds to customer/client requests or events as they occur.
* Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.##
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* Qualifications:

** You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research..
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* Minimum Qualification:

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* Education:

** Master's (6+ months) --or-- PhD (1+ yr) of experience
** Relevant experience must include the following:
*** Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction.
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* Preferred Qualifications:

**** Masters** (6+ months) **--or-- PhD (1+ yr)
** of experience in one or more of the following:
* Semiconductor Inspection (wafer, package, etc.).
* Fundamental physical processes, troubleshoot complex ultra-high precision equipment across a…