Principal Engineer, Thermal Engineering

#
** Welcome!**## .Principal Engineer, Thermal Engineering page is loaded## Principal Engineer, Thermal Engineering locations:
US, Oregon, Hillsboro:
US, Arizona, Phoenix time type:
Full time posted on:
Posted Todayjob requisition :
JR0279186#
** Job Details:**##

Job Description:

As a senior member of Intel’s Thermal Mechanical Engineering team, you will lead the development of advanced thermal and mechanical solutions for Data Center CPUs—spanning silicon, system, and datacenter levels. This role requires deep technical expertise, strong collaboration skills, and the ability to thrive in a fast-paced environment.
*
* Key Responsibilities:

*** Define product power and temperature limits based on system cooling capabilities.
* Provide thermal parameters for manufacturing teams.
* Conduct thermal analysis, design, prototyping, and testing of air and liquid cooling solutions.
* Apply expertise in conduction, convection, radiation, heat sinks, heat pipes, and vapor chambers.
* Perform thermal and pressure drop characterization and validate models.
* Optimize thermal management systems, including materials, contact pressure, and firmware policies.
* Simulate thermal behavior from silicon to PCB, considering materials, layout, and transient effects.
* Lead thermal design reviews and resolve technical issues.
* Collaborate cross-functionally with design, power, reliability, electrical, and mechanical teams.
* Drive technical readiness through research, experiments, and prototyping.
** Additional Responsibilities:
*** Serve as a domain expert influencing technical direction across Intel and the industry.
* Mentor technical leaders and promote Intel values.
* Formulate technical strategy aligned with organizational goals and deliver leadership solutions.
* Drive innovation in modeling, simulation, and automation to accelerate design cycles.
* Analyze performance, power, and thermal characteristics to guide design trade-offs.
* Lead teams in detailed design, testing, and prototype fabrication.##
*
* Qualifications:

***
* Qualifications:

***
* Minimum Requirements:

*** Bachelor’s degree in Mechanical Engineering or related field with 10+ years of related experience
* 8+ years of experience in:  +
** Heat transfer fundamentals for data center or client systems**.  +
** Thermal testing techniques using sensors and wind tunnels.**  +
** Thermal simulation software (Flotherm, Icepak).**  + CFD tools and thermal modeling processes
*
* Preferred Qualifications:

*** Advanced degree (MS/PhD) in Mechanical Engineering with focus on Heat Transfer, Fluid Dynamics, and Electronics Cooling.
* Proficiency in Python, MATLAB, LabVIEW, and statistical analysis.
* Hands-on experience with thermal metrology, DOE, instrumentation, and uncertainty analysis.
* Strong project leadership and cross-functional collaboration skills.
* Expertise in electronics cooling for systems/platforms, racks, and datacenters.
* Deep knowledge of TIMs, heat sinks, vapor chambers, heat pipes, fans, and liquid cooling systems.
* CAD proficiency (Solid Works or Creo) and CFD experience.
* Experience managing ODMs/vendors and full product lifecycle from concept to production.
* Familiarity with acoustic testing, DFM, and high-volume manufacturing.
* Ability to integrate novel thermal technologies aligned with Intel’s roadmap.## Job Type:Experienced Hire##

Shift: Shift 1 (United States of America)## Primary

Location:

US, Oregon, Hillsboro## Additional Locations:

US, Arizona, Phoenix## Business group:

At the Data Center Group (DCG), we're committed to delivering exceptional products and delighting our customers. We offer both broad-market Xeon-based solutions and custom x86-based products, ensuring tailored innovation for diverse needs across general-purpose compute, web services, HPC, and AI-accelerated systems. Our charter encompasses defining business strategy and roadmaps, product management, developing ecosystems and business opportunities, delivering strong financial performance, and reinvigorating x86 leadership.

Join us as we transform the data center segment through workload driven leadership products and close collaboration with our partners.## Posting Statement:

All qualified applicants…