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Wireless IC Packaging Architect WiFi/mmWave
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-01-12
Listing for:
Intel Corporation
Full Time
position Listed on 2026-01-12
Job specializations:
-
Engineering
Packaging Engineer, Systems Engineer
Job Description & How to Apply Below
A leading technology company is looking for a Silicon Packaging Architect/Engineer to innovate semiconductor packaging for WiFi and Bluetooth products. The role demands expertise in packaging technology development and cross-functional collaboration to meet industry standards. Ideal candidates will have a relevant degree, strong project management skills, and experience with advanced packaging processes. A competitive compensation package includes a high salary range and benefits.
The role is on-site in Phoenix, Arizona.
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