More jobs:
Wireless IC Packaging Architect WiFi/mmWave
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-01-10
Listing for:
Intel Corporation
Full Time
position Listed on 2026-01-10
Job specializations:
-
Engineering
Packaging Engineer, Systems Engineer
Job Description & How to Apply Below
A leading technology company is looking for a Silicon Packaging Architect/Engineer to innovate semiconductor packaging for WiFi and Bluetooth products. The role demands expertise in packaging technology development and cross-functional collaboration to meet industry standards. Ideal candidates will have a relevant degree, strong project management skills, and experience with advanced packaging processes. A competitive compensation package includes a high salary range and benefits.
The role is on-site in Phoenix, Arizona.
#J-18808-Ljbffr
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×