Foundry Technology Manufacturing - Senior Process Engineer - Dry Etch; Oregon or Arizona
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2025-12-26
Listing for:
Intel Corporation
Full Time
position Listed on 2025-12-26
Job specializations:
-
Engineering
Manufacturing Engineer, Systems Engineer, Electrical Engineering, Process Engineer
Job Description & How to Apply Below
#
** Welcome!**## .Foundry Technology Manufacturing - Senior Process Engineer - Dry Etch (Oregon or Arizona) page is loaded## Foundry Technology Manufacturing - Senior Process Engineer - Dry Etch (Oregon or Arizona) locations:
US, Oregon, Hillsboro:
US, Arizona, Phoenix time type:
Full time posted on:
Posted Todayjob requisition :
JR0279309#
** Job Details:**##
Job Description:
Manufacturing Development Customer Engineering (MDCE) is a new organization in Intel and is part of Intel Foundry Technology Manufacturing (FTM). Our mission is to effectively bridge the transition from Technology Development (TD) to High Volume Manufacturing (HVM), taking a technology node from 1st product PRQ to high yields across multiple products, and to enhance the technology for our customers. Intel Chandler, Arizona site is building new fabs for the latest technology nodes including Intel 18A and beyond.
Also, development of legacy technology with a foundry partner is in progress and will launch HVM to serve multiple global foundry customers. This exciting transformation at Intel needs talented candidates with FE Dry etch experience in Foundry to service local and global customers.
This job requisition is to seek an experienced Dry Etch engineer to join MDCE to build a strong Foundry Customer Engineering team including Integration and Device for various Intel technologies including 18A to service global Foundry customers. Candidates must possess detailed hands-on experience with sub-3nm GAA FETs. Device knowledge with experiences in the generation and analysis of device parametric data, design of experiment (DOE) principles, and engineering data analysis tools.
The role is focused on FE dry etch processing to support a range of applications and will work closely with both LTD and TFSM teams.
Note:
This role requires regular onsite presence to fulfill essential job responsibilities.
** Key Responsibilities
*** Drive technology development to enable high-volume manufacturing and future technologies, including process integration, equipment solutions, and feasibility studies to meet device specifications.
* Lead design and development of advanced manufacturing processes and/or reverse engineering, covering material selection, parameter optimization, equipment metrology, and system design for new product functionality.
* Recommend and implement equipment modifications to improve production efficiency, manufacturing techniques, and optimize output for existing products.
* Partner with equipment and material suppliers to develop and implement enabling technology elements.
* Conduct process technology feasibility studies using theoretical simulations and practical engineering methods.
* Stay current on industrial process and material trends; develop future process technology roadmaps in collaboration with vendor ecosystems to drive cost-sensitive innovation.
* Serve as a principal engineer and domain expert, influencing technical direction across the company and industry.
* Mentor technical leaders, grow the engineering community, act as a change agent, and model organizational values.
* Align organizational goals with technical vision, formulate strategies for leadership solutions, and execute relentlessly to bring products and technologies to market.##
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* Qualifications:
** Minimum qualifications are required to be initially considered for this position.
*
* Minimum Qualifications:
*** Bachelor’s degree in Electrical Engineering, Physics, or related STEM discipline.
* 9+ years of hands-on experience in CMOS device engineering, device physics, logic architecture, and interconnect development on leading-edge nodes.
* 5+ years of experience in: + Direct Front-end etch experience is required. + Dry Etch Logic Technology development.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
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* Preferred Qualifications:
*** Advanced degree (MS/PhD) in Electrical Engineering, Physics, or related field with 6+ years of relevant experience
* Hands-on experience with sub-3nm GAA FETs
* Ramp and High-Volume Manufacturing Environment Experience
* Industry standards and certification…
Position Requirements
10+ Years
work experience
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