Hardware Development Engineer, AWS CQC - Fabrication

Hardware Development Engineer, AWS CQC - Fabrication

Job  | Amazon Development Center U.S., Inc.

The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development – and in particular wire bonding, flip chip bonding, dicing – who will aid in AWS’s effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors.

Responsibilities include developing, improving and sustaining fabrication and packaging processes; analyzing inline metrology and electrical test data; interacting with project leads to provide feedback that continuously improves the process. Candidates must have a demonstrated background in solid engineering principles, and must have superlative data analysis, problem solving, and communication skills. Successful candidates will have experience in dicing, wire‑bonding, flip chip bonding techniques and tools.

Working effectively within a team environment is critical.

The schedule is late afternoon through late night for this role, 5pm-2am for example. The initial training will be performed in the daytime. Once the training is finished, the candidate is expected to work independently in the assigned hours.

The candidate will spend most of the time in a cleanroom environment, in a protective suit performing hands‑on packaging tasks using IC packaging equipment. The candidate will carry out packaging steps for quantum computing product chips, as well as for development projects.

Due to applicable export control laws and regulations, candidates must be either a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum, or be able to obtain a US export license. If you are unsure if you meet these requirements, please apply and Amazon will review your application for eligibility.

The AWS Center for Quantum Computing recognizes that developing quantum computing is a long‑term endeavor, not a quick process. The team is dedicated to tackling the significant challenges involved in building a functional quantum computer. We are approaching this ambitious goal with enthusiasm and determination.

The fabrication/packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips.

• Bachelor's degree in mechanical engineering, electrical engineering, material science, physics or equivalent, or Bachelor's degree
• Expertise in two or more of the following processes and tools:
  Flip chip bonding tools, wire bonding tools, saw dicing, stealth dicing, electrical probing on wafer/die

• 4+ years of industry or academic research experience
• Basic programming skills (e.g. Python, Julia, MATLAB)
• Experience conducting sophisticated analysis of complex data and translate the results into actionable deliverables, messages, and presentations
• In addition to skills related to packaging process, great to have general working knowledge in one or more of the following device fabrication areas: photo lithography, metal/dielectric/silicon etching, metal/dielectric thin film deposition
• Experience or knowledge in superconducting microwave devices or superconducting qubits is a plus

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct,…