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Electronics Engineer Packaging Engineer

Senior Microelectronic Packaging Design Engineer

Job in Ottawa, Ontario, Canada
Listing for: Sanmina-SCI Systems de México
Full Time position
Listed on 2026-02-28
Job specializations:
  • Engineering
    Electronics Engineer, Packaging Engineer
Salary/Wage Range or Industry Benchmark: 110000 - 140000 CAD Yearly CAD 110000.00 140000.00 YEAR
Job Description & How to Apply Below
A leading technology company in Ottawa is seeking a Microelectronic Packaging Design Engineer to develop innovative microelectronic packages. The role involves selecting technologies, designing modules, and generating key product documentation. Candidates should have a Bachelor’s degree in a relevant field, at least 8 years of experience, and proficiency with packaging design software. The compensation is competitive, ranging from $110,000 to $140,000 annually, promoting a focus on customer delivery within a multidisciplinary team.
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Position Requirements
10+ Years work experience
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