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Senior Microelectronic Packaging Design Engineer

Job in Ottawa, Ontario, Canada
Listing for: Sanmina
Full Time position
Listed on 2026-02-03
Job specializations:
  • Engineering
    Manufacturing Engineer, Electronics Engineer, Packaging Engineer, Product Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 CAD Yearly CAD 60000.00 80000.00 YEAR
Job Description & How to Apply Below
A leading technology firm in Ottawa is seeking a Microelectronic Packaging Design Engineer to support technology and product development programs. You will work with a team to design microelectronic packages and modules, ensuring compliance with product requirements. The ideal candidate has a Bachelor's Degree in Mechanical Engineering or similar, along with over 8 years of experience in hardware design, packaging, and tool proficiency.

This role is significant for innovative projects in various emerging markets.
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Position Requirements
10+ Years work experience
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