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Photonic Process Engineer: Wire Bonding & Die Attach

Job in Ottawa, Ontario, Canada
Listing for: Ciena Corporation
Full Time position
Listed on 2026-01-14
Job specializations:
  • Engineering
    Manufacturing Engineer, Quality Engineering, Process Engineer
Salary/Wage Range or Industry Benchmark: 71600 - 114400 CAD Yearly CAD 71600.00 114400.00 YEAR
Job Description & How to Apply Below
A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelor’s degree in mechanical engineering and 2–3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Competitive salary range of $71,600 to $114,400 and comprehensive benefits offered.
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