Senior Thermal Engineer

Senior Thermal Engineer – Corintis, Lausanne, Vaud, Switzerland

Corintis is a startup that provides advanced semiconductor cooling technologies. From climate modelling to drug discovery, the demand for computing power is growing, and more powerful chips generate more heat. Our mission is to remove the limitations of current cooling systems by integrating cooling directly inside the chip, enabling the sustainable computing of the future to address the biggest global challenges.

We operate from the EPFL campus near Lausanne, in a team-oriented environment with a diverse group of nationalities.

We are seeking a highly skilled and self-driven Thermal Engineer to contribute to the development and optimization of Corintis’ advanced thermal simulation and cooling technologies. You will support the design, modeling, and validation of next‑generation semiconductor cooling systems, ensuring high‑performance thermal management through rigorous multiphysics analysis. Reporting to the engineering leadership team, you will execute thermal design strategies, refine simulation models, and translate customer and system requirements into robust, manufacturable solutions.

• Design and develop microfluidic cooling devices based on customer specifications.
• Utilize analytical and numerical modelling to support device design and performance optimization.
• Create mechanical components and assemblies for seamless integration between our product offerings and the customer requirements.
• Produce detailed technical drawings and oversee the manufacturing process, maintaining high quality standards.
• Develop and implement specialized test setups to validate the cooling performance and packaging integrity of microfluidic solutions.
• Conduct experimental validation, including testing and data analysis, to characterize and refine prototype performance, ensuring optimal thermal and mechanical integration.
• Gather, analyse, and interpret data from experimental tests, using findings to inform and refine designs.
• Collaborate with customers to tailor solutions to specific HPC and AI platforms.
• Innovate advanced solutions for the mechanical integration of cooling devices into broader systems.
• Contribute to fundamental R&D activities within the Hardware team, fostering a collaborative environment.
• Research emerging technologies and trends in liquid cooling and thermal management to drive innovation of energy‑efficient and environmentally sustainable cooling solutions.

• M.Sc. in Mechanical Engineering, Microengineering, Materials Science, or a related field; a Ph.D. is a plus.
• Minimum of 5 years relevant industrial experience in liquid cooling for electronic systems, spanning R&D, product development, testing and industrialisation (ideally in data‑centre applications).
• Strong proficiency in mechanical design, tolerancing and technical drawing for manufacturing.
• Prior experience in leading a new product from design into volume production.
• Advanced CAD skills (Solid Works preferred).
• Hands‑on experience designing thermal management solutions for GPUs, CPUs or custom AI accelerators.
• Good understanding of advanced packaging (2.5D, 3D integration) and the associated thermal challenges.
• Knowledge of packaging and mechanical integration of microfluidic systems in commercial HPC or AI platforms.
• Familiarity with materials science as it relates to thermal management and system reliability for liquid cooling applications.
• Familiarity with failure mechanisms for liquid cooling in data‑centre applications, and the associated qualification tests.
• Direct experience with various manufacturing techniques for both prototyping and final production, including 3D manufacturing for rapid prototyping.
• Deep understanding of heat transfer and fluid dynamics, particularly at the microscale.
• Practical experience designing and building cooling loops and test benches for microchannel‑based cooling systems.
• Knowledge of industry standards and best practices for liquid cooling in HPC and data centres such as ASHRAE and OCP.
• Coding skills in Python and Arduino are a plus.
• Skilled in creating clear, high‑quality technical documentation.

• Enjoy high ownership and responsibility in a startup environment.
• Like building things from early concepts to real products.
• Are comfortable working with evolving requirements and limited structure.
• Enjoy working closely across teams and making fast, pragmatic decisions.
• Care deeply about product quality and industrialisation.

• You want a highly structured, slow‑moving corporate environment.
• You prefer narrowly defined roles with limited ownership.
• You are uncomfortable with ambiguity or fast iteration cycles.
• You lack experience or interest in liquid cooling technologies.
• You are looking for a fully remote position.