Electronics Packaging Analyst II, Telework
Huntsville, Madison County, Alabama, 35824, USA
Listed on 2026-03-07
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Engineering
Electronics Engineer, Engineering Design & Technologists, Aerospace / Aviation / Avionics
Description
Join us at Lockheed Martin as an Electronics Packaging Engineer within the Electronics Packaging department. You will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, and electronics and mechanical CAD (drawing development and release).
Location:
This position is a teleworking position.
Join us at Lockheed Martin as an Electronics Packaging Engineer within the Electronics Packaging department. You will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, and electronics and mechanical CAD (drawing development and release).
To be effective in this role, you will need:- Experience performing preliminary and detailed level stress, thermal, and solder fatigue analysis of spacecraft & missiles flight electronic components and boxes using standardized processes and tools.
- Experience working in a multi-disciplined team environment to help with design trades and detailed design/analysis activity.
- Understanding of applicable mechanical (thermal, materials, etc.) and system level requirements/parameters.
- Experience supporting development for reliable, compliant flight worthy components and structural assemblies which satisfy the contractual design criteria as well as any producibility requirements defined by Manufacturing and Quality.
- Experience providing test input/instrumentation data to environmental test personnel and collaborating with lead engineering personnel to interpret/correlate test results.
- 1+ years professional experience.
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Basic Qualifications- Bachelor of Science or higher from an accredited college in Mechanical Engineering or related discipline, or equivalent experience/combined education.
- Understand the basics of electronics packaging analysis, either through education or work experience, and be willing to learn and apply new/advanced analytical techniques necessary to perform various analysis tasks.
- Knowledge of and applicable experience with spacecraft or missiles analysis methods, specifically for electronic components, and including hand calculations.
- Experience with finite element modeling for random vibration and thermal analysis.
- Ability to work in a collaborative and highly integrated team environment.
- Experience with thermal and structural fatigue analysis of electronic components and attachments.
- Experience with NASTRAN, NX Advanced Simulation, Abaqus, Matlab, Mathcad and CREO.
- Static, vibration, acoustic, modal, shock, thermal test experience of aerospace flight hardware.
- Familiarity with different electronic package types and mounting methods.
- Possess good communication, both oral and written, social and presentation skills.
- Proficient in Microsoft Office, especially Excel.
None
Other Important Information You Should KnowExpression of Interest:
By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. Should this match be identified you may be contacted for this and future openings.
Ability to Work Remotely: Full-time Remote Telework:
The employee selected for this position will work remotely full time at a location other than a Lockheed Martin designated office/job site. Employees may travel to a Lockheed Martin office for periodic meetings.
Work Schedules:
Lockheed Martin supports a variety of alternate work schedules that provide additional flexibility to our employees. Schedules range from standard 40…
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