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Material Scientist​/Engineer

Remote / Online - Candidates ideally in
Derry, County Derry, BT47, Northern Ireland, UK
Listing for: Seagate Technology
Full Time, Remote/Work from Home position
Listed on 2026-01-14
Job specializations:
  • Engineering
    Materials Engineer, Process Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Position: Material Scientist / Engineer

From the videos, music and documents we share with friends and family on social networks, to the servers that form the backbone of enterprise data centers and cloud‑based computing, to the desktop and notebook computers that fuel our personal productivity, Seagate products help more people store, share, and protect their valuable digital content. With 97% of the world’s information being stored on hard drives, the rapid growth of digital data makes Seagate more important every day.

As an industry leader, Seagate provides unique career opportunities to be part of today’s major technology shifts. We can be found around the globe and at  Seagate’s Springtown facility in Derry/Londonderry, Northern Ireland is among the most advanced in the world in the design, development, and volume manufacturing of recording heads.

About the role - you will:

We are seeking highly motivated Material Scientists / Material Engineers to join our Process Engineering team supporting recording‑head wafer manufacturing. This is a rare opportunity to work at the forefront of advanced materials, thin‑film engineering, plasma processing, and nanoscale device fabrication. As a member of our Process Engineering organisation, you will contribute to the development, optimisation, and sustaining of critical wafer processes that enable next‑generation magnetic recording technologies.

We strongly encourage applications from recent PhD graduates, as well as experienced engineers looking to expand their expertise in a fast‑moving, high‑technology environment.

Key Responsibilities
  • Develop, optimise, and characterise thin‑film materials and processes used in recording‑head wafer fabrication (e.g., metals, dielectrics, magnetic alloys, barrier layers).
  • Drive improvements in film structure, composition, stress, uniformity, and functional properties through rigorous experimentation and analysis.
  • Support advanced wafer process modules such as sputter deposition, ALD, PECVD, etch, CMP, annealing, and metrology.
  • Apply scientific principles to diagnose material‑related defects, yield excursions, and process instabilities.
  • Collaborate with cross‑functional teams (equipment engineering, integration, metrology, product engineering, R&D) to accelerate process maturity and technology readiness.
  • Implement statistical and data‑driven methodologies (DoE, SPC, FDC, data modelling) to ensure process robustness and stability.
  • Document and communicate results through technical reports, presentations, and cross‑site collaboration.
About you:

Essential Qualifications

  • PhD in a relevant discipline, including but not limited to Materials Science, Materials Engineering, Physics/Chemistry, Nanotechnology, Electrical/Electronic Engineering (materials‑focused), Mechanical Engineering (with materials specialisation).
  • Equivalent industrial experience in any of the following areas:
    Thin‑film deposition (PVD, sputtering, ALD, PECVD, CVD), Surface engineering or plasma processing, Semiconductor or wafer‑level manufacturing, Magnetic materials or advanced functional materials, Micro/nano‑fabrication, Physical/chemical characterisation (TEM, SEM, XRD, XPS, AFM, ellipsometry, etc.).

Desired Skills & Attributes

  • Strong experimental design and problem‑solving capabilities.
  • Excellent analytical skills with an ability to interpret complex material/process data.
  • Good understanding of structure–property relationships in thin films.
  • Curiosity, creativity, and a proactive approach to learning.
  • Strong communication and teamwork skills.
  • Ability to work in a dynamic, high‑volume manufacturing environment.
What We Offer
  • Opportunity to work with state‑of‑the‑art wafer manufacturing technology.
  • Close collaboration with world‑leading engineers and scientists.
  • Mentorship for early‑career PhD graduates.
  • Clear development pathways into technical leadership.
  • Competitive salary and benefits package.

Completed applications should be submitted no later than midnight on Sunday, 15th February 2026.

“This role does not meet the criteria set by the Home Office for sponsorship on a Skilled Worker Visa as such sponsorship of this visa cannot be offered.”

This is a Full‑Time position working 39 hours per week.

Please…

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