×
Register Here to Apply for Jobs or Post Jobs. X

Senior Packaging Design Engineer; DIC

Remote / Online - Candidates ideally in
Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time, Remote/Work from Home position
Listed on 2026-01-13
Job specializations:
  • Engineering
    Systems Engineer, Product Engineer
Salary/Wage Range or Industry Benchmark: 164470 - 311890 USD Yearly USD 164470.00 311890.00 YEAR
Job Description & How to Apply Below
Position: Senior Packaging Design Engineer (3DIC) - Hybrid Role
A leading semiconductor manufacturer in Phoenix seeks a Senior Silicon Application Engineer (Packaging Design) to lead technical efforts in advanced packaging technologies. This role involves working with customers to define and develop design tools, ensuring successful product adoption. Candidates should have a bachelor's degree in a relevant field and over 7 years of experience in package design. The position offers a competitive salary, professional development opportunities, and the flexibility of a hybrid work model.
#J-18808-Ljbffr
Position Requirements
10+ Years work experience
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)

Job Posting Language
Employment Category
Education (minimum level)
Filters
Education Level
Experience Level (years)
Posted in last:
Salary