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Senior Packaging Design Engineer; DIC

Remote / Online - Candidates ideally in
Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time, Remote/Work from Home position
Listed on 2026-01-13
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 164470 - 311890 USD Yearly USD 164470.00 311890.00 YEAR
Job Description & How to Apply Below
Position: Senior Packaging Design Engineer (3DIC) - Hybrid Role
A leading technology company is looking for a Senior Silicon Application Engineer (Packaging Design) in Phoenix, Arizona. This position involves advanced packaging technologies and working closely with foundry customers on design tools and methodologies. The ideal candidate should have a Bachelor's degree in Electrical or Computer Engineering and over 7 years of relevant experience. The role offers opportunities to lead technical engagements and engage directly with customers while collaborating across teams to solve design challenges.

A competitive salary and hybrid work model are included.
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Position Requirements
10+ Years work experience
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