Manufacturing Process Engineer II

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high-performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Circuits’ products are used in a range of wired and wireless communications applications.

Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment.

Mini-Circuits’ sells its products to over 20,000 customers globally through our direct sales force, applications engineering staff, sales representatives, as well as through our extensive website.

Supports the development of process technologies and the acquisition, development and qualification of manufacturing equipment for the realization of new products and support of the existing products during the life cycle. Supports the development of continuous improvement processes and oversees the development an implementation of manufacturing processes to achieve operational excellence.

Salary Range: $75,000-$100,000 per year

• Set up new production lines; study and recommend improvements to existing processes; evaluate equipment to be used in manufacturing processes & ensure documentation is completed for qualification of newly required equipment.
• Oversee the development of precision, robust assembly fixtures and tooling for new product assembly for the prototype and production phase.
• Lead and actively participate in design review meetings.
• Work to continuously improve processes both on the production floor as well as transactional by collaborating with various departments.
• Work to improve safety, quality, and productivity using ergonomics, time studies, procedural analysis, product design/redesign, and specification of tooling, fixturing, controls and mechanization/automation.
• Assist in identifying opportunities for process improvement, waste removal, and cost reduction.
• Partner with outside departments on improvements to production output and troubleshoot/solve problems using RCA.
• Review new models being introduced (NPI) for manufacturability and monitor pilot runs.
• Identify and develop requirements for processes for manufacturing new products and provide training.
• Review and validate qualification plans, documentation, and new processes.
• Monitor the implementation of solutions to achieve objectives and expected benefits.
• Create, review and revise CPs created within the department, as necessary.
• Ensure that ECNs are submitted for corrections and/or improvements.
• Present KPIs and create presentations for leadership, as required.
• Stay current on industry trends, technologies, and best practices to drive innovation and optimization.
• Ensures issues are addressed at the root cause level and implemented on all similar products and processes.
• Ensures optimum utilization of equipment and space by coordinating the layout of production areas.
• Facilitate the implementation of lean principles and continuous improvement events.
• Apply design of experiments techniques and establish standards and procedures to resolve problems.

The duties, responsibilities and expectations described above are not a comprehensive list and additional tasks may be assigned to the member, within the scope of the position.

• Bachelor’s Degree in Engineering (or similar field) with a manufacturing process background.
• Two to five years of experience in electronics (electromechanical) manufacturing, mechanical engineering, mechanical design, manufacturing engineering or related field, working with the design, integration, and manufacturing of RF and Microwave electronic components and assemblies.
• Experience in semiconductor assembly and packaging.
• Experience with mechanical reliability testing and related equipment.
• In-depth knowledge of available assembly processes/technologies such as surface mount, high frequency assemblies, die and wire attach, encapsulation.
• Knowledge of industry standards, PCB…