Principal Thermal Mechanical Engineer

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We're a technology company that leads with our humanity-driving our business priorities alongside meaningful social, community, and societal impact.

At Ciena, we build the world's most adaptive networks to meet ever increasing bandwidth demands. As part of our Packaging team, this role is an opportunity to shape next generation electro-optic modules and integrated circuits (ICs) that power high performance connectivity around the globe. Join a collaborative engineering environment where deep technical expertise, innovation, and hands-on problem solving directly influence the products our customers rely on increasing bandwidth demands.

As part of our Packaging team, this role is an opportunity to shape next generation electrooptic modules and integrated circuits (ICs) that power high-performance connectivity around the globe. Join a collaborative engineering environment where deep technical expertise, innovation, and hands on problem solving directly influence the products our customers rely on.increasing bandwidth demands. As part of our Packaging team, this role is an opportunity to shape next generation electrooptic modules and integrated circuits (ICs) that power high performance connectivity around the globe.

Join a collaborative engineering environment where deep technical expertise, innovation, and handson problem solving directly influence the products our customers rely on.

How You Will Contribute

• Lead end-to-end development and delivery of thermal and/or mechanical solutions for IC level components and electro-optic modules.
• Perform detailed system and package level thermal simulations and present findings to cross-functional stakeholders.
• Conduct mechanical finite element analysis (FEA) for static and dynamic loads, vibration, shock, and thermal stresses.
• Develop practical thermal and mechanical design solutions to resolve complex challenges efficiently and cost effectively.
• Apply analytical and empirical methods to optimize packaging and cooling strategies.
• Design and execute thermal tests in a laboratory environment to validate performance
• Collaborate closely with cross sector teams, manufacturing, and external partners throughout the product lifecycle-from concept through mass production.toend development level components and electrooptic modules level thermal simulations and present findings to cross functional stakeholderseffectivelysector teams, manufacturing, and external partners throughout the product lifecycle-from concept through

The Must Haves

• Bachelor's degree in Mechanical Engineering or related field and 10+ years of relevant experience at the silicon or system level.
• Strong background in heat transfer and electronics thermal management
• Deep understanding of natural and forced convection cooling technologies
• Experience running CFD simulations using ANSYS Icepack or Flotherm
• Experience conducting mechanical FEA using ANSYS Workbench or similar tools
• Hands on experience with thermal design for PCBs, substrates, ICs, and enclosures
• Excellent communication skills and a track record of collaborating effectively across teams to define requirements, solve complex problems and drive programs to successful completion.on experience with thermal design for PCBs, substrates, ICs, and enclosures

Nice to Haves

• CAD experience with Solid Works or Creo
• Knowledge of thermal interface materials (TIMs), heat sinks, heat spreaders, cold plates, sockets, and fans
• Experience supporting qualification activities and performance validation
• Background spanning both silicon level and system level development
• Strong troubleshooting, planning, and organizational skills
• Experience working in fast paced, cross disciplinary engineering environments
• Ability to manage multiple priorities while driving programs to successful completion level and system level development paced, cross disciplinary engineering environments

Pay Range:

The annual salary range for this position is $157,100 - $250,900 USD.

Pay…