Engineering Manager; Semiconductor

Qualifications and Experience

• IC SOCKET (or Connector) design & development experience
• Design & develop of products using machining, stamping, and injection molding parts
• Experience from concept design to mass production, including prototype build, design iteration, and production release
• DFM / DFA / DFMEA experience for both part-level and assembly-level designs
• Tolerance analysis and GD&T application for high-precision mechanical components
• Experience in Mechanical, Thermal, and Electrical co-design
• Design experience for high power, high current, and/or high-speed applications
• Solid Works: 3D modeling and 2D drawing creation
• Mechanical simulation (FEA) using Solid Works
• Thermal simulation for air or liquid cooling solutions using Solid Works
• High-frequency electromagnetic structure simulation using Ansys HFSS
• Technical discussion with customers
• Ability to translate customer requirements into engineering specifications
• Failure analysis and root cause investigation, including definition of corrective actions
• Project management experience
• Supplier technical discussion and coordination with tool makers, machining vendors, molding vendors or in‑house factory
• Team management experience
• Cross‑functional collaboration with manufacturing, quality, sales, and supply chain teams
• Experience leading projects and/or engineering teams as a technical lead or engineering manager

For interested candidates, please send your updated resume:

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Angela Teh Ling Wei

(CEI No.R1104464)

Recruit Express Pte Ltd

EA License No. 99C4599